21st Advanced Building Skins Conference & Expo

On November 3 + 4 international architects, engineers, scientists and representatives from the construction industry will present new projects and developments in building envelope design at the 21st Advanced Building Skins Conference & Expo in Bern, Switzerland. This conference is the premier international event for innovative building skins, offering high-calibre presentations and productive networking opportunities with specialists from more than 50 countries. 

Our keynote speaker will be Neil Leach, a visionary architect and theorist known for his pioneering work in Artificial Intelligence and digital design. Neil Leach has been at the forefront of exploring how AI, machine learning, and computational design are transforming the future of architecture. In his keynote, Leach will discuss how AI is not just a tool for automation, but a catalyst for a paradigm shift in how we design and construct building envelopes. According to Leach, the future of the building skin lies in its ability to process information and evolve through digital intelligence, moving beyond static structures toward truly "thinking" architectures.

Artificial Intelligence in façade design will also be covered in our conference session on Digital Twins and Machine Learning. Other conference sessions will cover the following topics:

• New Developments in Glass and Shading Systems
• Integrating Solar Technologies into the Building Envelope
• Innovative Products and Technologies for the Building Skin
• Sustainable Design and High-Performance Façade Engineering
• Performance-Based Building Retrofits

Register by 30 April for the 20% early-bird discount: The two-day ticket for 680 € includes lunches and the full conference documentation. Early birds who register by 30 April will receive a 20% discount. 

The event will be held in English on 3-4 November 2026 at the Kursaal Conference Center in Bern, Switzerland.

Learn more and register today!